Wafer processing methods are provided. The methods may include cutting respective edges of a wafer and an adhesive a predetermined angle before grinding a back surface of the wafer.
申请公布号
US2014106649(A1)
申请公布日期
2014.04.17
申请号
US201314056270
申请日期
2013.10.17
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM TAE-YEONG;KANG PIL-KYU;PARK BYUNG-IYUL;PARK JIN-HO
