Manufacturing semiconductor component, comprises e.g. providing three-dimensional substrate body with first closed substrate surface, applying film-forming starting material on body, and forming layer sequence having semiconductor material

摘要

Manufacturing semiconductor component, comprises (a) providing at least one three-dimensional substrate body (1) having a first closed substrate surface (1a), (b) arranging the three-dimensional substrate body in a chamber, (c) applying at least one film-forming starting material (3) on the three-dimensional substrate body along the first closed substrate surface, and (d) forming a layer sequence (4) comprising at least one semiconductor material, on the first closed substrate surface of the three-dimensional substrate body, using material of the film-forming starting material.