发明名称 METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin electronic device capable of stably keeping the conduction between an electronic component and an external electrode and easily forming a through electrode, and to provide an electronic device.SOLUTION: A method for manufacturing an electronic device 1 comprises the steps of: filling a hollow D of a base material 10 with an embedding metal 21; mounting an electronic component 50 on the base material 10; hermetically bonding the region covered by a cover material 60 and the base material 10; forming a base 11 and a through electrode 22 by polishing the bonded base material 10; and forming an external electrode 60.
申请公布号 JP2014067828(A) 申请公布日期 2014.04.17
申请号 JP20120211307 申请日期 2012.09.25
申请人 SEIKO INSTRUMENTS INC 发明人 NAKAMURA NORIHIKO;KISHI MATSUO
分类号 H01L23/04;H01L23/02;H01L23/12 主分类号 H01L23/04
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