发明名称 |
METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin electronic device capable of stably keeping the conduction between an electronic component and an external electrode and easily forming a through electrode, and to provide an electronic device.SOLUTION: A method for manufacturing an electronic device 1 comprises the steps of: filling a hollow D of a base material 10 with an embedding metal 21; mounting an electronic component 50 on the base material 10; hermetically bonding the region covered by a cover material 60 and the base material 10; forming a base 11 and a through electrode 22 by polishing the bonded base material 10; and forming an external electrode 60. |
申请公布号 |
JP2014067828(A) |
申请公布日期 |
2014.04.17 |
申请号 |
JP20120211307 |
申请日期 |
2012.09.25 |
申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
NAKAMURA NORIHIKO;KISHI MATSUO |
分类号 |
H01L23/04;H01L23/02;H01L23/12 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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