发明名称 |
METHOD FOR MANUFACTURING ELECTRONIC DEVICE CONTAINER, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND MOBILE EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device container capable of preventing a ceramic material of a base substrate from being cracked when bonding a lid to a sealing part of the base substrate.SOLUTION: A method for manufacturing an electronic device container including a base substrate 2 and a lid 3 comprises the steps of: preparing the base substrate 2 with a sealing part 10; preparing the lid 3 having a brazing material layer 11b on one principal surface of a base material layer 11a for a lid and a stress relaxation part 12; arranging the lid 3 so that the sealing part 10 matches the brazing material layer 11b; and bonding the lid 3 to the sealing part 10 by irradiating the lid 3 with an energy beam. |
申请公布号 |
JP2014067849(A) |
申请公布日期 |
2014.04.17 |
申请号 |
JP20120211896 |
申请日期 |
2012.09.26 |
申请人 |
SEIKO EPSON CORP |
发明人 |
MIYASAKA HIDEO |
分类号 |
H01L23/02;H01L23/08;H03H3/02;H03H9/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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