发明名称 METHOD FOR MANUFACTURING ELECTRONIC DEVICE CONTAINER, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND MOBILE EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device container capable of preventing a ceramic material of a base substrate from being cracked when bonding a lid to a sealing part of the base substrate.SOLUTION: A method for manufacturing an electronic device container including a base substrate 2 and a lid 3 comprises the steps of: preparing the base substrate 2 with a sealing part 10; preparing the lid 3 having a brazing material layer 11b on one principal surface of a base material layer 11a for a lid and a stress relaxation part 12; arranging the lid 3 so that the sealing part 10 matches the brazing material layer 11b; and bonding the lid 3 to the sealing part 10 by irradiating the lid 3 with an energy beam.
申请公布号 JP2014067849(A) 申请公布日期 2014.04.17
申请号 JP20120211896 申请日期 2012.09.26
申请人 SEIKO EPSON CORP 发明人 MIYASAKA HIDEO
分类号 H01L23/02;H01L23/08;H03H3/02;H03H9/02 主分类号 H01L23/02
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