| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method capable of efficiently inspecting fine defects on a bevel portion of a substrate.SOLUTION: A method for inspecting a wafer bevel portion sets dummy coordinates on software and moves the FOV of an SEM to an inspection position (S1). SEM images of low magnification based on each dummy coordinates are obtained while scanning the dummy coordinates (S2). Whether a particle P is detected in the obtained SEM image or not is determined (S3). The FOV is moved to the dummy coordinates where the particle P is detected (S4) and an SEM image of high magnification is obtained (S5). Whether the particle P is detected or not is determined on the basis of this SEM image (S6) and a defect is determined to be present if it is detected (YES). |
