| 摘要 |
A semiconductor device includes: a first semiconductor chip; a second semiconductor chip placed such that a front face of the second semiconductor chip faces a front face of the first semiconductor chip, and being smaller in size than the first semiconductor chip; an expansion portion extending outward from at least one side face of the second semiconductor chip; a wiring board placed such that a front face of the wiring board faces the front face of the first semiconductor chip and a back face of the second semiconductor chip; and a first interconnect formed on the back face of the second semiconductor chip and a back face of the expansion portion, and being in connection to the wiring board. |
