发明名称 Microphone System with Integrated Passive Device Die
摘要 A microphone system has a package forming an interior chamber, and a MEMS microphone secured within the interior chamber. The package forms an aperture for permitting acoustic access to the interior of the chamber and thus, the MEMS microphone. The system also has two dies; namely, the system has a primary circuit die within the interior chamber, and an integrated passive device die electrically connected with the primary circuit die. The primary circuit die is electrically connected with the MEMS microphone and has at least one active circuit element.
申请公布号 US2014103464(A1) 申请公布日期 2014.04.17
申请号 US201213652950 申请日期 2012.10.16
申请人 ANALOG DEVICES, INC. 发明人 BOLOGNIA DAVID;GUERY ALAIN VALENTIN
分类号 H01L27/20;H01L21/60 主分类号 H01L27/20
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