发明名称 SEMICONDUCTOR DEVICE
摘要 A semiconductor device includes a first semiconductor layer of a first conductivity type. A second semiconductor layer of a second conductivity type is on the first semiconductor layer. A third semiconductor layer is on the second semiconductor layer. A fourth semiconductor layer is selectively in the first semiconductor layer. A first trench and second trench penetrate from a surface of the third layer through the second layer to reach the first layer. An embedded electrode is in the first trench. A control electrode is above the embedded electrode via an insulating film. A lower end of the second trench is connected to the fourth semiconductor layer. A first main electrode is electrically connected to the first layer. A second main electrode is provided in the second trench. A Schottky junction is formed by the first layer and the second main electrode at a sidewall of the second trench.
申请公布号 US2014103425(A1) 申请公布日期 2014.04.17
申请号 US201314107909 申请日期 2013.12.16
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SAITO WATARU;ONO SYOTARO;TANIUCHI SHUNJI;WATANABE MIHO;YAMASHITA HIROAKI
分类号 H01L29/78 主分类号 H01L29/78
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