发明名称 |
APPARATUS TO PERFORM A NON-CONTACT TEST OF A SEMICONDUCTOR PACKAGE |
摘要 |
An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield. |
申请公布号 |
US2014104411(A1) |
申请公布日期 |
2014.04.17 |
申请号 |
US201213671759 |
申请日期 |
2012.11.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD |
发明人 |
RYU CHANG-HYUN;LIM SSANG-GUN;SON DONG-HAE;PARK POOM-SEONG |
分类号 |
G01R31/265 |
主分类号 |
G01R31/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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