发明名称 |
METHOD FOR COPPER PLATING |
摘要 |
A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to said heterocyclic core by a spacer is disclosed. Said method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates. |
申请公布号 |
US2014102910(A1) |
申请公布日期 |
2014.04.17 |
申请号 |
US201214124268 |
申请日期 |
2012.05.07 |
申请人 |
ROHDE DIRK;ROELFS BERND;HIGUCHI JUN;ATOTECH DEUTSCHLAND GMBH |
发明人 |
ROHDE DIRK;ROELFS BERND;HIGUCHI JUN |
分类号 |
C25D3/38 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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