| 摘要 |
A method of die bonding, the method has steps of: heating a substrate to a predetermined temperature; sucking at least one die, the at least one die with a base temperature, the base temperature being less than the predetermined temperature; the at least one die bonding on the substrate; cooling the substrate with the bonded die; and moving the substrate with the bonded die to a loading and unloading position, heating another substrate to a predetermined temperature, and repeating the said steps. |
