发明名称 |
DEVICES HAVING ANISOTROPIC CONDUCTIVITY HEATSINKS, AND METHODS OF MAKING THEREOF |
摘要 |
In accordance with an embodiment of the present invention, a device includes a circuit board with a thermally conductive core layer and a chip disposed over the circuit board. The device further includes a heat sink disposed over the chip. The thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction. The first direction is perpendicular to the second direction. The heat sink is thermally coupled to the thermally conductive core layer. |
申请公布号 |
EP2664228(A4) |
申请公布日期 |
2014.04.16 |
申请号 |
EP20120746708 |
申请日期 |
2012.02.14 |
申请人 |
HUAWEI TECHNOLOGIES CO., LTD. |
发明人 |
MOHAMMED, ANWAR;ZHAO, RENZHE |
分类号 |
H05K7/20;H01L23/367;H01L23/373 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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