| 摘要 |
The invention relates to a wafer handling system (1) for handling a plurality of essentially parallel aligned wafers (2), the system comprising:
- a wafer interacting part (10) comprising wafer interacting means for acting upon the plurality of wafers (2), and
- at least one wafer receiving part (11, 12) for receiving the plurality of wafers (2), characterized in that
the wafer interacting part (10) and the at least one wafer receiving part (11) are dimensioned relative to each other such that one of the wafer interacting part (10) and the wafer receiving part (11, 12) may inserted into the other of the wafer interacting part (10) and the wafer receiving part (11, 12). |
