| 摘要 |
Disclosed are a sputtering device and a sputtering method using the same. The disclosed sputtering device includes a vacuum chamber in which a sputtering object and a target are individually mounted and multiple magnetic part units applying a magnetic field while individually approaching the target or separating from the target. By the above configuration, the present invention can conduct uniform deposition for all surfaces of the object and quickly and smoothly conduct a correction action by individually driving the units in case of non-uniform deposition. Therefore the quality of a product can be stabilized. |
