Conductive fine particles, method for plating fine particles, and substrate structure

摘要

This invention provides a conductive fine particle for soldering two or more electrodes of an electric circuit, the conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like.

A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3 × 10-5 to 7 × 10-5 (1/K).