ELECTROCONDUCTIVE PARTICLES AND ANISOTROPIC CONDUCTIVE MATERIAL USING SAME

摘要

Provided are electroconductive particles that afford improved connection reliability in a microcircuit. Also provided is an anisotropic conductive material using the particles. Each of the electroconductive particles used has a resin particle (11), a non-electrolytic metal plating layer (12) that covers the surface of the resin particle, and a sputtered non-Au metal layer (13) that forms an outermost layer. Because the hard sputtered metal layer (13) is formed at the outermost layer, the electroconductive particles can be made to bite into the wiring, and high connection reliability can be obtained.