发明名称 SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE
摘要 <p>A GaN-based semiconductor is epitaxially grown on a silicon substrate with a surface orientation of (111). The difference between the lattice constant of the GaN and the silicon (111) surface is approximately 17%, which is quite large. Therefore, the dislocation density of the grown GaN exceeds 10 10 cm -2 . Screw dislocation density causes the leak current of the transistor using GaN to increases. Furthermore, the mobility of the transistor is reduced. Provided is a semiconductor substrate comprising a silicon substrate and a nitride semiconductor layer that is epitaxially grown on a (150) surface of the silicon substrate.</p>
申请公布号 KR20140045303(A) 申请公布日期 2014.04.16
申请号 KR20137018263 申请日期 2012.01.23
申请人 FURUKAWA ELECTRIC CO., LTD.;FUJI ELECTRIC CO., LTD. 发明人 IWAMI MASAYUKI;KOKAWA TAKUYA
分类号 H01L21/20 主分类号 H01L21/20
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