| 摘要 |
The present invention relates to an adhesion-augmented glue gun. Melting silicon, sprayed from a glue gun nozzle, is compressed by a round and concave compressing tip, so as to remove a viewless gap between a target object for gluing and the melting silicon, while evenly spreading the melting silicon onto the target object. Thereby, the adhesion force of the melting silicon is augmented, and the target object can be firmly attached. By using a round and convex portion of the compressing tip, the tip of the melting silicon can be easily severed, so as to have the same shape of silicon. |
