| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board that allows thin film formation, that has excellent electroless plating performance and excellent peel strength, and that can form a microscopic circuit, provide a metal clad laminate and a resin sheet that form the printed wiring board, and provide a manufacturing method of the printed wiring board. SOLUTION: A printed wiring board comprises, on a core base material, one circuit layer or two or more circuit layers via an interlayer insulation layer. At least one insulation surface of surfaces of the core base material and the interlayer insulation layer is provided with the circuit layer via a primer resin layer. The primer resin layer includes a primer resin including a resin selected from the group consisting of a polyamide resin, a polyimide resin, and a polyamide-imide resin. The surface provided with the circuit layer is roughened. COPYRIGHT: (C)2012,JPO&INPIT |
