发明名称 Process for producing optical semiconductor device
摘要 <p>The present invention relates to a process for producing an optical semiconductor device, the process including: disposing a sheet for optical-semiconductor-element encapsulation including a resin sheet A (1) and a plurality of resin layers B (2) discontinuously embedded in the resin sheet A (1) and a plurality of optical semiconductor elements mounted on a substrate in such a way that each of the plurality of optical semiconductor elements faces either one of the plurality of resin layers B (2); and followed by embedding each of the plurality of optical semiconductor elements in either one of the plurality of resin layers B (2). According to the process of the invention, optical semiconductor elements can be embedded at once. As a result, an optical semiconductor device which is excellent in LED element protection and durability can be easily obtained. Consequently, the optical semiconductor device obtained can have a prolonged life.</p>
申请公布号 EP2031666(A3) 申请公布日期 2014.04.16
申请号 EP20080015489 申请日期 2008.09.02
申请人 NITTO DENKO CORPORATION 发明人 HARADA, NORIAKI;KIMURA, RYUUICHI;AKAZAWA, KOUJI
分类号 H01L33/00;C08G59/24;C08G59/42;C09D163/00;H01L33/48 主分类号 H01L33/00
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