发明名称 |
Process for producing optical semiconductor device |
摘要 |
<p>The present invention relates to a process for producing an optical semiconductor device, the process including: disposing a sheet for optical-semiconductor-element encapsulation including a resin sheet A (1) and a plurality of resin layers B (2) discontinuously embedded in the resin sheet A (1) and a plurality of optical semiconductor elements mounted on a substrate in such a way that each of the plurality of optical semiconductor elements faces either one of the plurality of resin layers B (2); and followed by embedding each of the plurality of optical semiconductor elements in either one of the plurality of resin layers B (2). According to the process of the invention, optical semiconductor elements can be embedded at once. As a result, an optical semiconductor device which is excellent in LED element protection and durability can be easily obtained. Consequently, the optical semiconductor device obtained can have a prolonged life.</p> |
申请公布号 |
EP2031666(A3) |
申请公布日期 |
2014.04.16 |
申请号 |
EP20080015489 |
申请日期 |
2008.09.02 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
HARADA, NORIAKI;KIMURA, RYUUICHI;AKAZAWA, KOUJI |
分类号 |
H01L33/00;C08G59/24;C08G59/42;C09D163/00;H01L33/48 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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