| 摘要 |
<p>An electronic endoscope device with enhanced heat resistance and durability is provided. In the electronic endoscope device, an optical member, and a frame body made of a material having a thermal expansion coefficient different from the optical member and holding the optical member are arranged at an insertion section to be inserted into a subject. The optical member and the frame body are connected to each other via adhesive layers of a three-layer structure having mutually different thermal expansion coefficients.</p> |
