| 发明名称 |
CHIP-INLAID FLOORING MATERIAL USING PLA RESIN |
| 摘要 |
Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder. |
| 申请公布号 |
EP2719846(A1) |
申请公布日期 |
2014.04.16 |
| 申请号 |
EP20110867845 |
申请日期 |
2011.06.13 |
| 申请人 |
LG HAUSYS, LTD. |
发明人 |
KWON, HYUN-JONG;KIM, JI-YOUNG;PARK, KI-BONG;KANG, CHANG-WON;KWON, JUN-HYUK;PARK, SANG-SUN;KIM, JANG-KI;LEE, GYEONG-MIN;HUANG, CHENG-ZHE |
| 分类号 |
E04F15/10;B32B7/12;B32B27/12;B32B27/18;B32B27/36;E04F15/02 |
主分类号 |
E04F15/10 |
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