Electronic component with stacked semiconductor chips

摘要

Semiconductor component has spacer (19) which is arranged between first module component (2) and second module component (3), whereby module components are connected electrically and in at least one place, clearance between spacer and contact area (27) of lower module component is smaller than 80 micrometers and in particular smaller than 40 micrometers. An INDEPENDENT claims included for method of production of semiconductor component.