发明名称 |
Interposers, electronic modules, and methods for forming the same |
摘要 |
<p>An interposer comprises a substrate and a plurality of posts. Each of the posts extends substantially through a thickness of the substrate. A method for forming an interposer comprises forming a fill hole in a first side of a substrate and a cavity in a second side of the substrate. The cavity is in fluidic communication with the fill hole. A plurality of posts is formed in the cavity. An encapsulant is injected through the fill hole into the cavity to encapsulate the plurality of posts.
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申请公布号 |
EP2624290(A3) |
申请公布日期 |
2014.04.16 |
申请号 |
EP20130166078 |
申请日期 |
2009.04.03 |
申请人 |
THE CHARLES STARK DRAPER LABORATORY, INC. |
发明人 |
RACZ, LIVIA M.;TEPOLT, GARY B.;THOMPSON, JEFFREY C.;LANGDO, THOMAS A.;MUELLER, ANDREW J. |
分类号 |
H01L21/68;B81C1/00;H01L21/48;H01L21/60;H01L23/13;H01L23/498;H01L23/538;H01L25/10 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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