发明名称 |
Wafer processing deposition shielding components |
摘要 |
Embodiments described herein generally relate to components for a semiconductor processing chamber, a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a process kit. In one embodiment a lower shield for encircling a sputtering target and a substrate support is provided. The lower shield comprises a cylindrical outer band having a first diameter dimensioned to encircle the sputtering surface of the sputtering target and the substrate support, the cylindrical band comprising a top wall that surrounds a sputtering surface of a sputtering target and a bottom wall that surrounds the substrate support, a support ledge comprising a resting surface and extending radially outward from the cylindrical outer band, a base plate extending radially inward from the bottom wall of the cylindrical band, and a cylindrical inner band coupled with the base plate and partially surrounding a peripheral edge of the substrate support. |
申请公布号 |
US8696878(B2) |
申请公布日期 |
2014.04.15 |
申请号 |
US201213457441 |
申请日期 |
2012.04.26 |
申请人 |
RIKER MARTIN LEE;MILLER KEITH A.;SUBRAMANI ANANTHA;APPLIED MATERIALS, INC. |
发明人 |
RIKER MARTIN LEE;MILLER KEITH A.;SUBRAMANI ANANTHA |
分类号 |
C25B9/00;B05C11/11;C23C14/00;C23C14/34;C23C14/50;C23C14/56;C23C16/00;C23C16/458;C25B11/00;C25B13/00;H01J37/32;H01J37/34 |
主分类号 |
C25B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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