发明名称 |
Epoxy resin composition and semiconductor device |
摘要 |
An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition. |
申请公布号 |
US8697803(B2) |
申请公布日期 |
2014.04.15 |
申请号 |
US201213667344 |
申请日期 |
2012.11.02 |
申请人 |
SUMITOMO BAKELITE CO., LTD.;SUMITOMO BAKELITE COMPANY, LTD. |
发明人 |
KOTANI TAKAHIRO;SEKI HIDETOSHI;MAEDA MASAKATSU;SHIGENO KAZUYA;NISHITANI YOSHINORI |
分类号 |
C08K7/18;C08K3/04;C08K3/36;C08L63/02;H01L23/29 |
主分类号 |
C08K7/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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