发明名称 Semiconductor wiring patterns
摘要 A semiconductor device of the invention include a rectangular semiconductor element mounted on a substrate formed with an external input terminal, an external output terminal, and a plurality of wiring patterns connected to each of the external input terminal and the external output terminal. The semiconductor element comprises, a plurality of first electrodes formed along a first edge of a surface thereof, a plurality of second electrodes formed along an edge opposite to the first edge of the surface, a plurality of third electrodes formed in the neighborhood of a functional block, and an internal wiring for connecting the first electrodes and the third electrodes. The substrate comprises, a first wiring pattern for connecting the external input terminal and the first electrodes, a second wiring pattern for connecting the external output terminal and the second electrodes, and a third wiring pattern for connecting the first electrodes and the third electrodes.
申请公布号 US8698314(B2) 申请公布日期 2014.04.15
申请号 US201213404243 申请日期 2012.02.24
申请人 NAKAYAMA AKIRA;OKI SEMICONDUCTOR CO., LTD. 发明人 NAKAYAMA AKIRA
分类号 H01L23/48 主分类号 H01L23/48
代理机构 代理人
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