发明名称 |
Wireless chip and manufacturing method of the same |
摘要 |
The present invention provides a new type wireless chip that can be used without being fixed on a product. Specifically, a wireless chip can have a new function by a sealing step. One feature of a wireless chip according to the present invention is to have a structure in which an integrated circuit is sealed by films. In particular, the films sealing the integrated circuit have a hollow structure; therefore the wireless chip can have a new function. |
申请公布号 |
US8698262(B2) |
申请公布日期 |
2014.04.15 |
申请号 |
US20050213997 |
申请日期 |
2005.08.30 |
申请人 |
TSURUME TAKUYA;DAIRIKI KOJI;KUSUMOTO NAOTO;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
TSURUME TAKUYA;DAIRIKI KOJI;KUSUMOTO NAOTO |
分类号 |
H01L21/14 |
主分类号 |
H01L21/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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