发明名称 Wireless chip and manufacturing method of the same
摘要 The present invention provides a new type wireless chip that can be used without being fixed on a product. Specifically, a wireless chip can have a new function by a sealing step. One feature of a wireless chip according to the present invention is to have a structure in which an integrated circuit is sealed by films. In particular, the films sealing the integrated circuit have a hollow structure; therefore the wireless chip can have a new function.
申请公布号 US8698262(B2) 申请公布日期 2014.04.15
申请号 US20050213997 申请日期 2005.08.30
申请人 TSURUME TAKUYA;DAIRIKI KOJI;KUSUMOTO NAOTO;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 TSURUME TAKUYA;DAIRIKI KOJI;KUSUMOTO NAOTO
分类号 H01L21/14 主分类号 H01L21/14
代理机构 代理人
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