| 摘要 |
A wiring substrate includes a first wiring layer, a first insulation layer, a second wiring layer, and a first wiring pattern. The second wiring layer includes a first metal foil which is thinner than the first wiring layer. A first via in the first insulation layer is in contact with the first and second wiring layers. The first via is arranged to fill a first through hole and a first recess. The first through hole is extended through the first insulation layer and includes a first open end of a first opening diameter and a second open end of a second opening diameter. Wherein, the second opening diameter is smaller than the first opening diameter. The first recess is connected to the first through hole. The first recess has a larger diameter than the second opening diameter. The first metal foil is connected to the first through hole and includes a first opening which has a larger opening diameter than the first opening diameter. |
