发明名称 |
Multi-chip package with spacer for blocking interchip heat transfer |
摘要 |
A multi-chip package comprises a semiconductor chip stack structure comprising a semiconductor chip stack including a first semiconductor chip having a first power rating and a second semiconductor chip having a second power rating, the first and second semiconductor chips being stacked one on top of another; and a heat transfer blocking spacer interposed between the first semiconductor chip and the second semiconductor chip. |
申请公布号 |
US8698304(B2) |
申请公布日期 |
2014.04.15 |
申请号 |
US20070747270 |
申请日期 |
2007.05.11 |
申请人 |
YOO JAE-WOOK;CHO EUN-SEOK;HWANG HEO-JUNG;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YOO JAE-WOOK;CHO EUN-SEOK;HWANG HEO-JUNG |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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