PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

摘要

The present invention relates to a printed circuit board, a semiconductor package, and a method for manufacturing the printed circuit board and the semiconductor package. The method for manufacturing the semiconductor package comprises a step for forming a circuit having a predetermined pattern on a PCB; a step for spraying a first insulating material on the PCB; a step for removing the first insulating material of the remaining part by exposing and developing the PCB; a step for forming a solder bump on a circuit part exposed by removing the first insulating material; a step for molding a constant part of the upper part of the PCB by filling a second insulating material on the PCB; a step for mounting a semiconductor chip having a contact unit on the PCB; and a step for soldering the contact unit with the solder bump by applying heat pressure to the semiconductor chip and completing a package in which the semiconductor chip and the PCB are united by connecting the remaining part of the semiconductor chip excluding the contact unit with the second insulating material. [Reference numerals] (AA) Start; (BB) End; (S401) Form a circuit of a predetermined pattern on a PCB; (S402) Spray a first insulating material on a substrate comprising the circuit; (S403) Removing the remaining first insulating material excluding an edge part of the substrate by exposing and developing the substrate; (S404) Forming a solder bump on the circuit exposed by removing the first insulating material; (S405) Mold a part of the upper unit of the PCB comprising the solder bump by filling a second insulating material on the PCB comprising a circuit part in which the solder bump is formed; (S406) Mounting a semiconductor chip on the PCB in order that a contact unit of the semiconductor chip is faced to the solder bump; (S407) Complete a package by connecting the semiconductor chip and the substrate with heat pressure