发明名称 |
Collimator bonding structure and method |
摘要 |
An image sensor is disclosed that includes a solid state semiconductor imager having a metallized catch pad, a collimator having a metallized layer that faces a sensor anode, the metallized layer joined with the metallized catch pad to form a metal bond between the solid state semiconductor imager and the collimator. Methods of making the joined solid state semiconductor imager and collimator assembly are also disclosed. |
申请公布号 |
US8698925(B2) |
申请公布日期 |
2014.04.15 |
申请号 |
US20100764862 |
申请日期 |
2010.04.21 |
申请人 |
COSTELLO KENNETH A.;RODERICK KEVIN J.;YIN EDWARD;FOWLER DOUGLAS;INTEVAC, INC. |
发明人 |
COSTELLO KENNETH A.;RODERICK KEVIN J.;YIN EDWARD;FOWLER DOUGLAS |
分类号 |
H04N3/14;H04N5/335 |
主分类号 |
H04N3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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