发明名称 |
Waveform monitor apparatus of injection molding machine |
摘要 |
When a waveform monitor apparatus 1 of an injection molding machine M for monitoring an operation waveform at least during molding is configured by mounting the waveform monitor apparatus 1 on the injection molding machine M for performing molding according to a specific molding system, a parting opening detecting means Fp for detecting change data of a parting opening Lm to a time during molding, and an operation waveform displaying means Fd for displaying at least change data from a resin filling start is into a mold 2 to a cooling time termination to of the mold 2, detected by the parting opening detecting means Fp, on a waveform displaying portion 5 of a screen 4v on a display 4 attached to a molding machine controller 3 are provided. |
申请公布号 |
US8696342(B2) |
申请公布日期 |
2014.04.15 |
申请号 |
US201213554259 |
申请日期 |
2012.07.20 |
申请人 |
KASUGA NOBUKAZU;MURATA HIROFUMI;HAKODA TAKASHI;ICHIKAWA OSAMU;NISSEI PLASTIC INDUSTRIAL CO., LTD. |
发明人 |
KASUGA NOBUKAZU;MURATA HIROFUMI;HAKODA TAKASHI;ICHIKAWA OSAMU |
分类号 |
B29C45/77;B29C45/78 |
主分类号 |
B29C45/77 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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