A CIRCUIT BOARD, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING THEREOF

摘要

A circuit board, according to an embodiment of the present invention, comprises a base layer, an adhesive film, a conductive circuit, and a penetration via. A plurality of adhesive films and conductive circuits can be alternately laminated on the base layer. The penetration via is formed by soldering. The penetration via comprises various conductive materials because the base layer is not damaged in a soldering process. Conductive circuits which perform different functions are easily connected by forming the penetration via. Therefore, the circuit board performs a complex function. The circuit board controls the thickness of the conductive circuit without damaging the conductive circuit even when the base layer is folded and curved. The circuit board having multiple structures can implement the function of an electronic circuit while maintaining a fabric function or a clothes function.