METHOD FOR PROCESSING SUBSTRATE WITH PATTERN

摘要

Disclosed is a method for properly dividing a substrate having a pattern. A first scheduled division line extending along an orientation flat and a second scheduled division line perpendicular to the first scheduled division line are irradiated with a laser beam to divide the substrate having the pattern into a lattice shape. As the laser beam is scanned along the first and second scheduled division lines, a processing trace formed in a workpiece by a unit pulse light of the laser beam is dispersed along the first and second scheduled division lines so that crack may occur in the workpiece due to the processing trace. When a division point is formed along the first scheduled division line, the laser beam is scanned under a first process condition such that the crack may reach an opposite main surface. In addition, when a division point is formed along the second scheduled division line, the laser beam is scanned under a second process condition such that the crack may stay in the substrate having the pattern.