| 摘要 |
Disclosed is a method for manufacturing a stacked multi-chip semiconductor package with high reliability capable of implementing a high-capacity memory device by using a lead frame and an interposer. The method for manufacturing a stacked multi-chip semiconductor package comprises: a step for preparing the lead frame in which an interposer mounting unit is prepared; a step for mounting the interposer on the interposer mounting unit of the lead frame; a step for stacking a semiconductor chip on a first side of the interposer; a step for performing first wire bonding which connects the semiconductor chip, a lead, and the interposer; a step for stacking the semiconductor chip on a second side of the interposer by reversing the lead frame; a step for performing second wire bonding which connects the semiconductor chip, the lead, and the interposer; and a step for performing a molding process which seals the semiconductor chip, which is stacked on the upper and lower parts of the interposer, and a wire. [Reference numerals] (AA) Start;(BB) End;(S100) Prepare a lead frame which an interposer mounting unit is prepared;(S200) Mount an interposer;(S300) Stack a semiconductor chip on a first side of the interposer;(S400) Perform first wire bonding;(S500) Stack the semiconductor chip on a second side of the interposer;(S600) Perform second wire bonding;(S700) Perform molding using EMC |
