发光装置封装件,申请号TW100105921-传众专利搜索

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发明名称	发光装置封装件
摘要
申请公布号	TWI434443	申请公布日期	2014.04.11
申请号	TW100105921	申请日期	2011.02.23
申请人	ＬＧ伊诺特股份有限公司南韩	发明人	金惠荣
分类号	H01L33/62	主分类号	H01L33/62
代理机构		代理人	陈瑞田高雄市凤山区建国路3段256之1号
主权项
地址	南韩

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