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发明名称
半导体封装结构及其制法
摘要
申请公布号
TWI434629
申请公布日期
2014.04.11
申请号
TW100129815
申请日期
2011.08.19
申请人
欣兴电子股份有限公司 桃园县桃园市龟山工业区兴邦路38号
发明人
胡迪群;胡玉山
分类号
H05K1/18;H05K3/32
主分类号
H05K1/18
代理机构
代理人
陈昭诚 台北市中正区杭州南路1段15之1号9楼
主权项
地址
桃园县桃园市龟山工业区兴邦路38号
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