| 摘要 |
Provided is a substrate heating apparatus which reduces a temperature change of a substrate whereupon a semiconductor chip is mounted and prevents breakage of a connecting section before and after an applying operation. An applying apparatus provided with such substrate heating apparatus and a substrate heating method are also provided. The substrate heating apparatus is provided for heating the substrate from below. The substrate is transferred in one direction, and the applying operation is performed to a work which is arranged on the substrate while the substrate is being transferred. The substrate heating apparatus is provided with a heating member, which has a flat upper surface abutting to a bottom surface of the substrate for heating the substrate, and a jetting opening formed on the upper surface for jetting a heating gas onto the bottom surface of the substrate. The substrate heating apparatus is also provided with a lift mechanism for bringing up/down the heating member. The liquid material applying apparatus provided with such substrate heating apparatus, and the substrate heating method are also provided. |
