发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CORELESS SUBSTRATE AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a first metal layer on a carrier; forming an insulation layer directly on the first metal layer; exposing a portion of the first metal layer for directly attaching to a die interconnect connecting to an integrated circuit; forming a second metal layer directly on the insulation layer opposite the side of the insulation layer exposed by removing the carrier; and forming a protective layer directly on the insulation layer and the second metal layer, the protective layer exposing a portion of the second metal layer for directly attaching an external interconnect. |
申请公布号 |
US2014097475(A1) |
申请公布日期 |
2014.04.10 |
申请号 |
US201313742580 |
申请日期 |
2013.01.16 |
申请人 |
JUNG JINHEE;ROH YOUNGDAL;PARK KYOUNGHEE |
发明人 |
JUNG JINHEE;ROH YOUNGDAL;PARK KYOUNGHEE |
分类号 |
H01L23/535;H01L21/768 |
主分类号 |
H01L23/535 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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