| 发明名称 |
SOLDER ALLOY FOR LOW-TEMPERATURE PROCESSING |
| 摘要 |
<p>A solder composition is provided comprising from about 5.5 to 7.0 percent by weight of bismuth, from about 2.0 to 2.5 percent by weight of silver, from about 0.5 to 0.7 percent by weight of copper, and the remainder of the composition being tin. The use of the solder composition and an electronic device comprising the solder composition are also provided.</p> |
| 申请公布号 |
WO2014053066(A1) |
申请公布日期 |
2014.04.10 |
| 申请号 |
WO2013CA50751 |
申请日期 |
2013.10.04 |
| 申请人 |
CELESTICA INTERNATIONAL INC. |
发明人 |
SNUGOVSKY, POLINA;BAGHERI, SIMIN;ROMANSKY, MARIANNE;SNUGOVSKY, LEONID;PEROVIC, DOUG |
| 分类号 |
B23K35/26;B23K35/22 |
主分类号 |
B23K35/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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