发明名称 Electroless plating method and plating film obtained by the electroless plating method
摘要 Provided is an electroless plating method comprising the steps of: electrolytic-polishing the surface of a work; forming a first plating layer by electric-strike-plating the electrolytic-polished work with a metal having a high surface-cohesiveness to the work; forming a second plating layer on the first plating layer by electroless-plating the work, including the first plating layer, in a first electroless plating solution containing metallic salts; forming a third plating layer by electroless-plating the work, including the first and second plating layers, in a second electroless plating solution containing fluoride resin; removing fat from the work by ultrasonic waves before the electrolytic polishing; preserving the passive state of the work by acid and base treatment after the electrolytic polishing; and stabilizing the plated state of the work by treating the work in a neutralizing solution after at least one of the steps-forming the first plating layer, forming the second plating layer, and forming the third plating layer.
申请公布号 KR101383323(B1) 申请公布日期 2014.04.10
申请号 KR20120079263 申请日期 2012.07.20
申请人 发明人
分类号 C23C18/16;C23C28/00;C25F3/16 主分类号 C23C18/16
代理机构 代理人
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