| 摘要 |
Provided are: a metal material for use in an electronic component and having low insertion/removal resistance, low whisker occurrence, and high durability; and a method for producing the same. A metal material (10) for use in an electronic component and equipped with a substrate (11), an A-layer (14) for configuring the outermost layer of the substrate (11), and formed from Sn, In, or an alloy of these elements, and a B-layer (13) for configuring an intermediate layer provided between the substrate (11) and the A-layer (14), and formed from Ag, Au, Pt, Pd, Ru, Rh, Os, Ir, or an alloy of these elements, wherein the thickness of the outermost layer (A-layer) (14) is 0.002-0.2μm, and the thickness of the intermediate layer (B-layer) (13) is greater than 0.3μm. |
