SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

Provided are a semiconductor device which enables a reduction in the number of bonding wires, and a manufacturing method therefor. A semiconductor device (30) is provided with two or more semiconductor elements (4) each having electrodes on a first principal surface and a second principal surface, respectively. This semiconductor device (30) is further provided with: an electrode plate (6) which has one surface joined to the electrode (41) on the first principal surface of the semiconductor element (4) via a first joining material layer (10) and extending over the electrodes (41) on the first principal surfaces of the two or more semiconductor elements (4); and a conductive plate (1) which has a semiconductor element joining part (2) jointed to the electrode (42) on the second principal surface of the semiconductor element (4) via a second joining material layer (11) and connected to the electrodes (42) on the second principal surfaces of the two or more semiconductor elements (4), and a first lead terminal (3). The other surface of the electrode plate (6) and a second lead terminal (3a, 3b) are connected by bonding wires (5) of required thickness and number.