LASER DRILLING APPARATUS FOR FORMING HOLES THROUGH A SUBSTRATE FOR BACK-CONTACT TYPE SOLAR CELL AND METHOD OF FORMING HOLES USING THE APPARATUS

摘要

The present invention relates to a laser drilling apparatus for forming a through hole on a solar cell substrate and a method for forming a through hole using the apparatus. According to the present invention, provided are the laser drilling apparatus and the method for forming a through hole using the apparatus capable of forming a high quality through hole on a solar cell substrate with improved speed and simultaneously drilling a plurality of substrates.