发明名称 ANISOTROPIC CONDUCTIVE FILM, CONNECTION METHOD, AND JOINED BODY
摘要 PROBLEM TO BE SOLVED: To provide an anisotropic conductive film using a cationic curing agent, which satisfies demands for prevention of a short circuit, a superior particle trapping rate and low connection resistance in an electronic component in a joined body to be obtained from the anisotropic conductive film, which can be cured at a low temperature and can be fast cured, which prevents corrosion of a wire possessed by an electronic component, and which has excellent adhesiveness.SOLUTION: The anisotropic conductive film is used for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component, and the film includes: a conductive particle-containing layer containing conductive particles, a filler and a cationic curing agent; and an insulating adhesive layer containing a cationic curing agent but no filler. The conductive particles are at least either metal particles or metal-coated resin particles. The filler is at least either a metal hydroxide or a metal oxide.
申请公布号 JP2014062184(A) 申请公布日期 2014.04.10
申请号 JP20120208156 申请日期 2012.09.21
申请人 DEXERIALS CORP 发明人 FUKAYA TATSURO;ITO SHOTA
分类号 C09J7/02;C09J201/00;H01B1/22;H01B5/16;H01R11/01 主分类号 C09J7/02
代理机构 代理人
主权项
地址