| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability in a semiconductor device.SOLUTION: A semiconductor device comprises: a substrate 10; a semiconductor element 12 mounted on the substrate 10; a plate-like member 26 which is fixed to on the semiconductor element 12 and has a thermal expansion coefficient different from that of the substrate 10; and a first adhesive 28 which is provided between the substrate 10 and the plate-like member 26 for bonding the substrate 10 with the plate-like member 26, and which is separated from the substrate 10 or the plate-like member 26 in a predetermined condition. With this semiconductor device, reliability in the semiconductor device can be improved depending on a temperature change in use of an electronic apparatus 200 on which the semiconductor device is mounted. |
