发明名称 PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING BIOCHIP, AND BIOCHIP
摘要 It is intended to obtain a photosensitive resin composition that is capable of forming a highly fine pattern with a high aspect ratio while attaining the high adhesion of the pattern to a substrate, having low autofluorescence, and being exceedingly suitable for producing a biochip that causes exceedingly low damage on cultured cells. The photosensitive resin composition for forming a biochip of the present invention contains: an epoxy compound (A1) of a particular structure having an oxycyclohexane skeleton having an epoxy group; an epoxy compound (A2) of a particular structure which is a polyvalent carboxylic acid derivative having an epoxidized cyclohexenyl group; a cationic photoinitiator (B); and a solvent (C).
申请公布号 US2014099243(A1) 申请公布日期 2014.04.10
申请号 US201214119724 申请日期 2012.05.16
申请人 KOTERA HIDETOSHI;OKONOGI ATSUHITO;OHOKA MASATAKA;MARUO KATSUYA;DAICEL CORPORATION;KYOTO UNIVERSITY 发明人 KOTERA HIDETOSHI;OKONOGI ATSUHITO;OHOKA MASATAKA;MARUO KATSUYA
分类号 G03F7/004;B01L3/00 主分类号 G03F7/004
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