发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING BIOCHIP, AND BIOCHIP |
摘要 |
It is intended to obtain a photosensitive resin composition that is capable of forming a highly fine pattern with a high aspect ratio while attaining the high adhesion of the pattern to a substrate, having low autofluorescence, and being exceedingly suitable for producing a biochip that causes exceedingly low damage on cultured cells. The photosensitive resin composition for forming a biochip of the present invention contains: an epoxy compound (A1) of a particular structure having an oxycyclohexane skeleton having an epoxy group; an epoxy compound (A2) of a particular structure which is a polyvalent carboxylic acid derivative having an epoxidized cyclohexenyl group; a cationic photoinitiator (B); and a solvent (C). |
申请公布号 |
US2014099243(A1) |
申请公布日期 |
2014.04.10 |
申请号 |
US201214119724 |
申请日期 |
2012.05.16 |
申请人 |
KOTERA HIDETOSHI;OKONOGI ATSUHITO;OHOKA MASATAKA;MARUO KATSUYA;DAICEL CORPORATION;KYOTO UNIVERSITY |
发明人 |
KOTERA HIDETOSHI;OKONOGI ATSUHITO;OHOKA MASATAKA;MARUO KATSUYA |
分类号 |
G03F7/004;B01L3/00 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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