发明名称 PACKAGE
摘要 A package includes a first die and a second die. An interface connects the first die and the second die. At least one of the first and second dies includes a memory. The interface is configured to transport both control signals and memory transactions. A multiplexing circuit multiplexes the control signals and the memory transactions onto the interface such that connections of the interface are shared by the control signals and the memory transactions.
申请公布号 US2014098617(A1) 申请公布日期 2014.04.10
申请号 US201314101444 申请日期 2013.12.10
申请人 STMICROELECTRONICS S.R.L.;STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED 发明人 JONES ANDREW MICHAEL;RYAN STUART;SCANDURRA ALBERTO
分类号 G11C7/10 主分类号 G11C7/10
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