发明名称 |
CIRCUIT BOARDS, METHODS OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE CIRCUIT BOARDS |
摘要 |
Provided is a circuit board, which may include a base layer, an adhesive film, a conductive circuit, and a through via. The adhesive film and the conductive circuit may be provided in plurality to be alternately stacked on the base layer. The through via may be formed through soldering. Since the base layer is not damaged during the soldering, the through via may include various conductive materials. The through via makes it possible to easily connect the conductive circuits having different functions to one another. Accordingly, the circuit board may have multi functions. Thicknesses of the conductive circuits may be adjusted to protect the conductive circuits from folding or bending of the base layer. The circuit board having a multi-layered structure can function not only as a fabric or clothes but also as an electronic circuit. |
申请公布号 |
US2014097525(A1) |
申请公布日期 |
2014.04.10 |
申请号 |
US201313788494 |
申请日期 |
2013.03.07 |
申请人 |
RESEARCH INSTITUTE ELECTRONICS AND TELECOMMUNICATIONS;ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
KIM JI EUN;SON YONG KI;KIM BAESUN;CHO IL YEON |
分类号 |
H05K1/03;H01L23/495;H05K1/11;H05K3/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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